2026 International Conference on Vehicle Engineering and Intelligent Technology (VEIT 2026)

About VEIT 2026

2026 International Conference on Vehicle Engineering and Intelligent Technology

2026 International Conference on Vehicle Engineering and Intelligent Technology (VEIT 2026) will be held from December 18 to 20, 2026 in Shenyang, China. The conference aims to build a high-end platform with academic exchange, technological innovation and industrial application, and widely gather well-known experts, scholars and industry elites from the global vehicle engineering and intelligent technology fields.

The conference was prepared under the guidance of the Presidium with important academic influence, including Professor Zhao Liang (Shenyang University of Aeronautics and Astronautics, China), Professor Sun Yang (Hebei University of Engineering, China), Professor Ammar Hawbani (Shenyang University of Aeronautics and Astronautics, China), Professor Hocine Imine (gustave eiffel University, France) and others. The members of the Technical Program Committee and Organizing Committee come from well-known institutions in China, Singapore, India, the United States, Turkey, Algeria and other countries, which reflects the extensive international participation and provides a solid guarantee for the scientific quality and global relevance of the conference.

The conference will discuss in depth the latest research results, cutting-edge technologies and development trends in this field, and promote extensive cooperation and experience sharing across disciplines and fields. We sincerely invite experts and scholars in related fields around the world to actively participate in the grand event and jointly create a new chapter in the development of vehicle engineering and intelligent technology.

Call For Papers

The topics of interest include, but are not limited to:

Vehicle Engineering

Automobile Structure and Materials

Power System and Transmission Technology

Automotive Electronics and Control System

New Energy Vehicle Technology

Automobile Manufacturing and Technology

Hardware Design of Intelligent Driving Assistance

Vehicle Dynamics and Multi-Body System Simulation

New Technology of New Energy Powertrain

Automobile Noise, Vibration And Comfort

New Materials for Vehicle And Innovation of Manufacturing Process

Vehicle Dynamics and Control

Man-Machine Interaction Design of Vehicles

Engine Technology of Vehicles

Friction, Transmission and Energy Consumption Evaluation of Vehicles

Intelligent Technology

Driverless Car

Intelligent Connected Vehicle

Intelligent Predictive Control Technology of Clutch

Intelligent System Design

Intelligent Fault Detection and Identification

Intelligent and Unmanned Operation of Vehicles

Automatic Driving and Advanced Driver Assistance System

Application of Artificial Intelligence in Vehicles

On-Board Intelligent System and Software

Intelligent Transportation and Urban Intelligent Travel

Edge Intelligence and On-Board AI Computing

Multi-Sensor Fusion and Environmental Perception Enhancement

Exploration of Quantum Computing and New Intelligent Algorithms

Vehicle Virtual Reality and Augmented Reality Technology

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Publication

Submit to Conference Proceedings (EI)

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published by SAE International (ISSN: 0148-7191) in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

About VEIT 2026

2026 International Conference on Vehicle Engineering and Intelligent Technology

Important Dates

Call For Papers

Submission

Publication

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